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Tue, 17 Oct 2023 03:11:30 +0000 Received: from nalasex01c.na.qualcomm.com (nalasex01c.na.qualcomm.com [10.47.97.35]) by NALASPPMTA01.qualcomm.com (8.17.1.5/8.17.1.5) with ESMTPS id 39H3BT9X004301 (version=TLSv1.2 cipher=ECDHE-RSA-AES256-GCM-SHA384 bits=256 verify=NOT); Tue, 17 Oct 2023 03:11:29 GMT Received: from hu-bjorande-lv.qualcomm.com (10.49.16.6) by nalasex01c.na.qualcomm.com (10.47.97.35) with Microsoft SMTP Server (version=TLS1_2, cipher=TLS_ECDHE_RSA_WITH_AES_256_GCM_SHA384) id 15.2.1118.39; Mon, 16 Oct 2023 20:11:28 -0700 From: Bjorn Andersson Date: Mon, 16 Oct 2023 20:11:17 -0700 Subject: [PATCH 09/12] dt-bindings: usb: qcom,dwc3: Rename to "glue" MIME-Version: 1.0 Message-ID: <20231016-dwc3-refactor-v1-9-ab4a84165470@quicinc.com> References: <20231016-dwc3-refactor-v1-0-ab4a84165470@quicinc.com> In-Reply-To: <20231016-dwc3-refactor-v1-0-ab4a84165470@quicinc.com> To: Bjorn Andersson , Konrad Dybcio , Greg Kroah-Hartman , Rob Herring , Krzysztof Kozlowski , Conor Dooley , Wesley Cheng , Thinh Nguyen , Felipe Balbi , Philipp Zabel CC: , , , , Johan Hovold , Krishna Kurapati PSSNV , "Bjorn Andersson" X-Mailer: b4 0.12.0 X-Developer-Signature: v=1; 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Mon, 16 Oct 2023 20:12:41 -0700 (PDT) X-getmail-retrieved-from-mailbox: INBOX X-GMAIL-THRID: 1779970724575419275 X-GMAIL-MSGID: 1779970724575419275 The Qualcomm USB block consists of three intertwined parts, the XHCI, the DWC3 core and the Qualcomm DWC3 glue. The exsting binding represents the Qualcomm glue part, with the other two represented as in a child node. Rename the qcom,dwc3 binding, to represent that this is indeed only the glue part, to make room for a combined binding. The large "select" is included to avoid the schema to be selected for validation with the upcoming flattened binding - which includes snps,dwc3 in the compatible. Signed-off-by: Bjorn Andersson Reviewed-by: Krzysztof Kozlowski --- .../usb/{qcom,dwc3.yaml => qcom,dwc3-glue.yaml} | 54 +++++++++++++++++++++- 1 file changed, 52 insertions(+), 2 deletions(-) diff --git a/Documentation/devicetree/bindings/usb/qcom,dwc3.yaml b/Documentation/devicetree/bindings/usb/qcom,dwc3-glue.yaml similarity index 89% rename from Documentation/devicetree/bindings/usb/qcom,dwc3.yaml rename to Documentation/devicetree/bindings/usb/qcom,dwc3-glue.yaml index 727abe41c422..bec0151b41d2 100644 --- a/Documentation/devicetree/bindings/usb/qcom,dwc3.yaml +++ b/Documentation/devicetree/bindings/usb/qcom,dwc3-glue.yaml @@ -1,14 +1,64 @@ # SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause) %YAML 1.2 --- -$id: http://devicetree.org/schemas/usb/qcom,dwc3.yaml# +$id: http://devicetree.org/schemas/usb/qcom,dwc3-glue.yaml# $schema: http://devicetree.org/meta-schemas/core.yaml# -title: Qualcomm SuperSpeed DWC3 USB SoC controller +title: Qualcomm SuperSpeed DWC3 USB SoC controller glue + +description: + This describes the Qualcomm glue-section of the SuperSpeed DWC3 USB + controller found in many Qualcomm platforms, with the XHCI and DWC3 core + portions described as a separate child device. + The combined representation, defined by qcom,dwc3.yaml is preferred. maintainers: - Wesley Cheng +select: + properties: + compatible: + items: + - enum: + - qcom,ipq4019-dwc3 + - qcom,ipq5018-dwc3 + - qcom,ipq5332-dwc3 + - qcom,ipq6018-dwc3 + - qcom,ipq8064-dwc3 + - qcom,ipq8074-dwc3 + - qcom,ipq9574-dwc3 + - qcom,msm8953-dwc3 + - qcom,msm8994-dwc3 + - qcom,msm8996-dwc3 + - qcom,msm8998-dwc3 + - qcom,qcm2290-dwc3 + - qcom,qcs404-dwc3 + - qcom,sa8775p-dwc3 + - qcom,sc7180-dwc3 + - qcom,sc7280-dwc3 + - qcom,sc8180x-dwc3 + - qcom,sc8280xp-dwc3 + - qcom,sc8280xp-dwc3-mp + - qcom,sdm660-dwc3 + - qcom,sdm670-dwc3 + - qcom,sdm845-dwc3 + - qcom,sdx55-dwc3 + - qcom,sdx65-dwc3 + - qcom,sdx75-dwc3 + - qcom,sm4250-dwc3 + - qcom,sm6115-dwc3 + - qcom,sm6125-dwc3 + - qcom,sm6350-dwc3 + - qcom,sm6375-dwc3 + - qcom,sm8150-dwc3 + - qcom,sm8250-dwc3 + - qcom,sm8350-dwc3 + - qcom,sm8450-dwc3 + - qcom,sm8550-dwc3 + - const: qcom,dwc3 + required: + - compatible + properties: compatible: items: