[v2,05/11] dt-bindings: thermal: k3-j72xx: elaborate on binding description
Commit Message
Elaborate on the function of this device node as well as some of the
properties this node uses.
Signed-off-by: Bryan Brattlof <bb@ti.com>
---
.../bindings/thermal/ti,j72xx-thermal.yaml | 19 ++++++++++++++++++-
1 file changed, 18 insertions(+), 1 deletion(-)
Comments
On 25/10/2022 15:15, Bryan Brattlof wrote:
> Elaborate on the function of this device node as well as some of the
> properties this node uses.
>
> Signed-off-by: Bryan Brattlof <bb@ti.com>
> ---
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Best regards,
Krzysztof
@@ -9,6 +9,19 @@ title: Texas Instruments J72XX VTM (DTS) binding
maintainers:
- Keerthy <j-keerthy@ti.com>
+description: |
+ The TI K3 family of SoCs typically have a Voltage & Thermal
+ Management (VTM) device to control up to 8 temperature diode
+ sensors to measure silicon junction temperatures from different
+ hotspots of the chip as well as provide temperature, interrupt
+ and alerting information.
+
+ The following polynomial equation can then be used to convert
+ value returned by this device into a temperature in Celsius
+
+ Temp(C) = (-9.2627e-12) * x^4 + (6.0373e-08) * x^3 + \
+ (-1.7058e-04) * x^2 + (3.2512e-01) * x + (-4.9003e+01)
+
properties:
compatible:
enum:
@@ -19,7 +32,11 @@ properties:
items:
- description: VTM cfg1 register space
- description: VTM cfg2 register space
- - description: VTM efuse register space
+ - description: |
+ A software trimming method must be applied to some Jacinto
+ devices to function properly. This eFuse region provides
+ the information needed for these SoCs to report
+ temperatures accurately.
power-domains:
maxItems: 1