Show patches with: Submitter = Daniel Lezcano       |    Archived = No       |   249 patches
« 1 2 3 »
Patch Series A/R/T S/W/F Date Submitter Delegate State
powercap: dtpm_cpu: Fix error check against freq_qos_add_request() powercap: dtpm_cpu: Fix error check against freq_qos_add_request() - - - --- 2024-02-13 Daniel Lezcano New
[v6,2/2] thermal/debugfs: Add thermal debugfs information for mitigation episodes [v6,1/2] thermal/debugfs: Add thermal cooling device debugfs information - - - --- 2024-01-09 Daniel Lezcano New
[v6,1/2] thermal/debugfs: Add thermal cooling device debugfs information [v6,1/2] thermal/debugfs: Add thermal cooling device debugfs information - - - --- 2024-01-09 Daniel Lezcano New
[GIT,PULL] timer drivers for v6.8-rc1 [GIT,PULL] timer drivers for v6.8-rc1 - - - --- 2024-01-01 Daniel Lezcano New
clocksource/drivers/imx: Fix -Wunused-but-set-variable warning clocksource/drivers/imx: Fix -Wunused-but-set-variable warning - - - --- 2023-12-27 Daniel Lezcano New
[v5,2/2] thermal/debugfs: Add thermal debugfs information for mitigation episodes [v5,1/2] thermal/debugfs: Add thermal cooling device debugfs information - - - --- 2023-12-27 Daniel Lezcano New
[v5,1/2] thermal/debugfs: Add thermal cooling device debugfs information [v5,1/2] thermal/debugfs: Add thermal cooling device debugfs information - - - --- 2023-12-27 Daniel Lezcano New
[v4,2/2] thermal/debugfs: Add thermal debugfs information for mitigation episodes [v4,1/2] thermal/debugfs: Add thermal cooling device debugfs information - - - --- 2023-12-27 Daniel Lezcano New
[v4,1/2] thermal/debugfs: Add thermal cooling device debugfs information [v4,1/2] thermal/debugfs: Add thermal cooling device debugfs information - - - --- 2023-12-27 Daniel Lezcano New
[v3,2/2] thermal/debugfs: Add thermal debugfs information for mitigation episodes [v3,1/2] thermal/debugfs: Add thermal cooling device debugfs information - - - --- 2023-12-19 Daniel Lezcano New
[v3,1/2] thermal/debugfs: Add thermal cooling device debugfs information [v3,1/2] thermal/debugfs: Add thermal cooling device debugfs information - - - --- 2023-12-19 Daniel Lezcano New
[v2,2/2] thermal/debugfs: Add thermal debugfs information for mitigation episodes [v2,1/2] thermal/debugfs: Add thermal cooling device debugfs information - - - --- 2023-12-18 Daniel Lezcano New
[v2,1/2] thermal/debugfs: Add thermal cooling device debugfs information [v2,1/2] thermal/debugfs: Add thermal cooling device debugfs information - - - --- 2023-12-18 Daniel Lezcano New
[v1,2/2] PM: QoS: Add a performance QoS [v1,1/2] PM: QoS: Rename freq to range constraint - - - --- 2023-12-13 Daniel Lezcano New
[v1,1/2] PM: QoS: Rename freq to range constraint [v1,1/2] PM: QoS: Rename freq to range constraint - - - --- 2023-12-13 Daniel Lezcano New
thermal/core: Check get_temp ops is present when registering a tz thermal/core: Check get_temp ops is present when registering a tz - - - --- 2023-12-13 Daniel Lezcano New
[v1,2/2] thermal/debugfs: Add thermal debugfs information for mitigation episodes [v1,1/2] thermal/debugfs: Add thermal cooling device debugfs information - - - --- 2023-12-12 Daniel Lezcano New
[v1,1/2] thermal/debugfs: Add thermal cooling device debugfs information [v1,1/2] thermal/debugfs: Add thermal cooling device debugfs information - - - --- 2023-12-12 Daniel Lezcano New
[RFC,2/2] PM: QoS: Add a performance QoS [RFC,1/2] pm_qos: Rename freq to interval constraint - - - --- 2023-12-01 Daniel Lezcano New
[RFC,1/2] pm_qos: Rename freq to interval constraint [RFC,1/2] pm_qos: Rename freq to interval constraint - - - --- 2023-12-01 Daniel Lezcano New
[RFC] thermal/debugfs: Add thermal debugfs information [RFC] thermal/debugfs: Add thermal debugfs information - - - --- 2023-11-10 Daniel Lezcano New
[GIT,PULL] timer drivers for v6.7-rc1 [GIT,PULL] timer drivers for v6.7-rc1 - - - --- 2023-10-25 Daniel Lezcano New
[GIT,PULL] thermal for v6.7-rc1 [GIT,PULL] thermal for v6.7-rc1 - - - --- 2023-10-24 Daniel Lezcano New
[2/2] thermal/core: Reorder the headers inclusion [1/2] thermal/core: Hardening the self-encapsulation - 1 - --- 2023-10-12 Daniel Lezcano New
[1/2] thermal/core: Hardening the self-encapsulation [1/2] thermal/core: Hardening the self-encapsulation - 1 - --- 2023-10-12 Daniel Lezcano New
[v2,4/4] thermal/drivers/int340x: Do not check the thermal zone state One more step to the thermal zone structure encapsulation 1 - - --- 2023-07-07 Daniel Lezcano New
[v2,3/4] thermal/drivers/int3400: Use thermal zone device wrappers One more step to the thermal zone structure encapsulation 1 - - --- 2023-07-07 Daniel Lezcano New
[v2,2/4] thermal/core: Reorder the headers inclusion One more step to the thermal zone structure encapsulation 1 - - --- 2023-07-07 Daniel Lezcano New
[v2,1/4] thermal/core: Hardening the self-encapsulation One more step to the thermal zone structure encapsulation 1 - - --- 2023-07-07 Daniel Lezcano New
thermal/drivers/loongson2: Fix thermal zone private data access thermal/drivers/loongson2: Fix thermal zone private data access - - - --- 2023-06-16 Daniel Lezcano New
[8/8] thermal/core: Move the thermal zone structure to the private core header [1/8] net/mlx5: Update the driver with the recent thermal changes - - - --- 2023-05-25 Daniel Lezcano New
[7/8] thermal/drivers/int340x: Use thermal zone device trip update [1/8] net/mlx5: Update the driver with the recent thermal changes - - - --- 2023-05-25 Daniel Lezcano New
[6/8] thermal/drivers/int340x: Do not check the thermal zone state [1/8] net/mlx5: Update the driver with the recent thermal changes - - - --- 2023-05-25 Daniel Lezcano New
[5/8] thermal/drivers/int3400: Use thermal zone device wrappers [1/8] net/mlx5: Update the driver with the recent thermal changes - - - --- 2023-05-25 Daniel Lezcano New
[4/8] thermal/core: Update the generic trip points [1/8] net/mlx5: Update the driver with the recent thermal changes - - - --- 2023-05-25 Daniel Lezcano New
[3/8] thermal/core: Reorder the headers inclusion [1/8] net/mlx5: Update the driver with the recent thermal changes - - - --- 2023-05-25 Daniel Lezcano New
[2/8] thermal/core: Hardening the self-encapsulation [1/8] net/mlx5: Update the driver with the recent thermal changes - - - --- 2023-05-25 Daniel Lezcano New
[1/8] net/mlx5: Update the driver with the recent thermal changes [1/8] net/mlx5: Update the driver with the recent thermal changes - 1 - --- 2023-05-25 Daniel Lezcano New
[GIT,PULL] thermal for v6.4-rc1 #3 [GIT,PULL] thermal for v6.4-rc1 #3 - - - --- 2023-04-26 Daniel Lezcano New
[GIT,PULL] timers material for v6.4-rc1 [GIT,PULL] timers material for v6.4-rc1 - - - --- 2023-04-25 Daniel Lezcano New
[v4,6/6] thermal/drivers/intel_menlow: Make additionnal sysfs information optional Thermal zone device structure encapsulation - - - --- 2023-04-19 Daniel Lezcano New
[v4,5/6] thermal/drivers/acpi: Move to dedicated function sysfs extra attr creation Thermal zone device structure encapsulation - - - --- 2023-04-19 Daniel Lezcano New
[v4,4/6] thermal/drivers/menlow: Use thermal_zone_device() Thermal zone device structure encapsulation - - - --- 2023-04-19 Daniel Lezcano New
[v4,3/6] thermal/drivers/acpi: Use thermal_zone_device() Thermal zone device structure encapsulation - - - --- 2023-04-19 Daniel Lezcano New
[v4,2/6] thermal/drivers/intel_pch_thermal: Use thermal driver device to write a trace Thermal zone device structure encapsulation - - - --- 2023-04-19 Daniel Lezcano New
[v4,1/6] thermal/core: Encapsulate tz->device field Thermal zone device structure encapsulation - - - --- 2023-04-19 Daniel Lezcano New
[v1,3/3] thermal/core: Move the thermal zone structure to the private core header Move the thermal zone device structure in private header - - - --- 2023-04-18 Daniel Lezcano New
[v1,2/3] thermal/core: Reorder the headers inclusion Move the thermal zone device structure in private header - - - --- 2023-04-18 Daniel Lezcano New
[v1,1/3] thermal/core: Hardening the self-encapsulation Move the thermal zone device structure in private header - - - --- 2023-04-18 Daniel Lezcano New
[GIT,PULL] thermal for v6.4-rc1 #2 [GIT,PULL] thermal for v6.4-rc1 #2 - - - --- 2023-04-16 Daniel Lezcano New
[RFC] thermal/core: Update the generic trip points [RFC] thermal/core: Update the generic trip points - - - --- 2023-04-13 Daniel Lezcano New
[v3,6/6] thermal/drivers/intel_menlow: Make additionnal sysfs information optional Thermal zone device structure encapsulation - - - --- 2023-04-13 Daniel Lezcano New
[v3,5/6] thermal/drivers/acpi: Make cross dev link optional by configuration Thermal zone device structure encapsulation - - - --- 2023-04-13 Daniel Lezcano New
[v3,4/6] thermal/drivers/menlow: Use thermal_zone_device() Thermal zone device structure encapsulation - - - --- 2023-04-13 Daniel Lezcano New
[v3,3/6] thermal/drivers/acpi: Use thermal_zone_device() Thermal zone device structure encapsulation - - - --- 2023-04-13 Daniel Lezcano New
[v3,2/6] thermal/drivers/intel_pch_thermal: Use thermal driver device to write a trace Thermal zone device structure encapsulation - - - --- 2023-04-13 Daniel Lezcano New
[v3,1/6] thermal/core: Encapsulate tz->device field Thermal zone device structure encapsulation - - - --- 2023-04-13 Daniel Lezcano New
[v2,7/7] thermal/drivers/intel_menlow: Make additionnal sysfs information optional Thermal zone device structure encapsulation - - - --- 2023-04-10 Daniel Lezcano New
[v2,6/7] thermal/drivers/acpi: Make cross dev link optional by configuration Thermal zone device structure encapsulation - - - --- 2023-04-10 Daniel Lezcano New
[v2,5/7] thermal/core: Prepare sanitizing thermal class sysfs content Thermal zone device structure encapsulation - - - --- 2023-04-10 Daniel Lezcano New
[v2,4/7] thermal/drivers/menlow: Use thermal_zone_device() Thermal zone device structure encapsulation - - - --- 2023-04-10 Daniel Lezcano New
[v2,3/7] thermal/drivers/acpi: Use thermal_zone_device() Thermal zone device structure encapsulation - - - --- 2023-04-10 Daniel Lezcano New
[v2,2/7] thermal/core: Encapsulate tz->device field Thermal zone device structure encapsulation - - - --- 2023-04-10 Daniel Lezcano New
[v2,1/7] thermal/drivers/intel_pch_thermal: Use thermal driver device to write a trace Thermal zone device structure encapsulation - - - --- 2023-04-10 Daniel Lezcano New
[v2,3/3] thermal/core: Alloc-copy-free the thermal zone parameters structure [v2,1/3] thermal/drivers/bcm2835: Remove buggy call to thermal_of_zone_unregister - - - --- 2023-04-04 Daniel Lezcano New
[v2,2/3] thermal/of: Unexport unused OF functions [v2,1/3] thermal/drivers/bcm2835: Remove buggy call to thermal_of_zone_unregister - - - --- 2023-04-04 Daniel Lezcano New
[v2,1/3] thermal/drivers/bcm2835: Remove buggy call to thermal_of_zone_unregister [v2,1/3] thermal/drivers/bcm2835: Remove buggy call to thermal_of_zone_unregister - - - --- 2023-04-04 Daniel Lezcano New
[GIT,PULL] thermal for v6.4-rc1 [GIT,PULL] thermal for v6.4-rc1 - - - --- 2023-04-01 Daniel Lezcano New
[v2,2/2] thermal/drivers/imx: Use the thermal framework for the trip point [v2,1/2] thermal/drivers/imx: Remove get_trip_temp ops - 1 - --- 2023-03-09 Daniel Lezcano New
[v2,1/2] thermal/drivers/imx: Remove get_trip_temp ops [v2,1/2] thermal/drivers/imx: Remove get_trip_temp ops - 1 - --- 2023-03-09 Daniel Lezcano New
[2/2] thermal/drivers/imx: Use the thermal framework for the trip point [1/2] thermal/drivers/imx: Remove get_trip_temp ops - - - --- 2023-03-08 Daniel Lezcano New
[1/2] thermal/drivers/imx: Remove get_trip_temp ops [1/2] thermal/drivers/imx: Remove get_trip_temp ops - - - --- 2023-03-08 Daniel Lezcano New
[v1,11/11] thermal/acpi: Use the thermal zone parameter to specify the device link [v1,01/11] thermal/core: Relocate the traces definition in thermal directory - - - --- 2023-03-07 Daniel Lezcano New
[v1,10/11] thermal/core: Alloc-copy-free the thermal zone parameters structure [v1,01/11] thermal/core: Relocate the traces definition in thermal directory - - - --- 2023-03-07 Daniel Lezcano New
[v1,09/11] thermal/core: Add a linked device parameter [v1,01/11] thermal/core: Relocate the traces definition in thermal directory - - - --- 2023-03-07 Daniel Lezcano New
[v1,08/11] thermal/of: Unexport unused OF functions [v1,01/11] thermal/core: Relocate the traces definition in thermal directory - - - --- 2023-03-07 Daniel Lezcano New
[v1,07/11] thermal/drivers/bcm2835: Remove buggy call to thermal_of_zone_unregister [v1,01/11] thermal/core: Relocate the traces definition in thermal directory - - - --- 2023-03-07 Daniel Lezcano New
[v1,06/11] thermal/drivers/ti: Use fixed update interval [v1,01/11] thermal/core: Relocate the traces definition in thermal directory - 1 - --- 2023-03-07 Daniel Lezcano New
[v1,05/11] thermal/drivers/stm: Don't set no_hwmon to false [v1,01/11] thermal/core: Relocate the traces definition in thermal directory - - - --- 2023-03-07 Daniel Lezcano New
[v1,04/11] thermal/drivers/db8500: Use driver dev instead of tz->device [v1,01/11] thermal/core: Relocate the traces definition in thermal directory - 1 - --- 2023-03-07 Daniel Lezcano New
[v1,03/11] thermal/drivers/intel_menlow: Remove add_one_attribute [v1,01/11] thermal/core: Relocate the traces definition in thermal directory - - - --- 2023-03-07 Daniel Lezcano New
[v1,02/11] thermal/drivers/intel_pch_thermal: Use thermal driver device to write a trace [v1,01/11] thermal/core: Relocate the traces definition in thermal directory - - - --- 2023-03-07 Daniel Lezcano New
[v1,01/11] thermal/core: Relocate the traces definition in thermal directory [v1,01/11] thermal/core: Relocate the traces definition in thermal directory - 1 - --- 2023-03-07 Daniel Lezcano New
[RFC] thermal/drivers/intel_menlow: Remove add_one_attribute [RFC] thermal/drivers/intel_menlow: Remove add_one_attribute - - - --- 2023-03-03 Daniel Lezcano New
[v5,18/18] thermal/drivers/acerhdf: Remove pointless governor test Self-encapsulate the thermal zone device structure 1 - - --- 2023-03-01 Daniel Lezcano New
[v5,17/18] thermal/drivers/acerhdf: Make interval setting only at module load time Self-encapsulate the thermal zone device structure 1 1 - --- 2023-03-01 Daniel Lezcano New
[v5,16/18] thermal/drivers/tegra: Remove unneeded lock when setting a trip point Self-encapsulate the thermal zone device structure 1 - - --- 2023-03-01 Daniel Lezcano New
[v5,15/18] thermal/hwmon: Use the thermal_core.h header Self-encapsulate the thermal zone device structure 1 1 - --- 2023-03-01 Daniel Lezcano New
[v5,14/18] thermal/drivers/da9062: Don't access the thermal zone device fields Self-encapsulate the thermal zone device structure - 1 - --- 2023-03-01 Daniel Lezcano New
[v5,13/18] thermal: Use thermal_zone_device_type() accessor Self-encapsulate the thermal zone device structure - 2 - --- 2023-03-01 Daniel Lezcano New
[v5,12/18] thermal: Add a thermal zone id accessor Self-encapsulate the thermal zone device structure 2 - - --- 2023-03-01 Daniel Lezcano New
[v5,11/18] thermal/drivers/spear: Don't use tz->device but pdev->dev Self-encapsulate the thermal zone device structure - - - --- 2023-03-01 Daniel Lezcano New
[v5,10/18] thermal/core: Add thermal_zone_device structure 'type' accessor Self-encapsulate the thermal zone device structure - - - --- 2023-03-01 Daniel Lezcano New
[v5,09/18] thermal: Don't use 'device' internal thermal zone structure field Self-encapsulate the thermal zone device structure - 2 - --- 2023-03-01 Daniel Lezcano New
[v5,08/18] thermal/hwmon: Use the right device for devm_thermal_add_hwmon_sysfs() Self-encapsulate the thermal zone device structure 2 1 - --- 2023-03-01 Daniel Lezcano New
[v5,07/18] thermal/hwmon: Do not set no_hwmon before calling thermal_add_hwmon_sysfs() Self-encapsulate the thermal zone device structure 2 1 - --- 2023-03-01 Daniel Lezcano New
[v5,06/18] thermal: Remove debug or error messages in get_temp() ops Self-encapsulate the thermal zone device structure 2 1 - --- 2023-03-01 Daniel Lezcano New
[v5,05/18] thermal/core: Show a debug message when get_temp() fails Self-encapsulate the thermal zone device structure 1 - - --- 2023-03-01 Daniel Lezcano New
[v5,04/18] thermal/core: Use the thermal zone 'devdata' accessor in remaining drivers Self-encapsulate the thermal zone device structure 5 1 - --- 2023-03-01 Daniel Lezcano New
[v5,03/18] thermal/core: Use the thermal zone 'devdata' accessor in hwmon located drivers Self-encapsulate the thermal zone device structure 3 - - --- 2023-03-01 Daniel Lezcano New
« 1 2 3 »