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[83.9.3.135]) by smtp.gmail.com with ESMTPSA id v2-20020a056512096200b004cc5f44747dsm1871094lft.220.2023.04.03.10.36.24 (version=TLS1_3 cipher=TLS_AES_256_GCM_SHA384 bits=256/256); Mon, 03 Apr 2023 10:36:25 -0700 (PDT) From: Konrad Dybcio Subject: [PATCH 0/9] RB1 + QCM2290 support Date: Mon, 03 Apr 2023 19:35:58 +0200 Message-Id: <20230403-topic-rb1_qcm-v1-0-ca849b62ba07@linaro.org> MIME-Version: 1.0 X-B4-Tracking: v=1; b=H4sIAH4OK2QC/x2N0QrCMAwAf2Xk2UDXjln8FZHRdNEFZjdTFWHs3 w17vIPjNqiswhUuzQbKX6myFIP21ECeUnkwymgM3vngOhfwvaySUakdXvmJ55hi9D2FjnqwhlJ lJE0lT1aVzzybXJXv8jsm19u+/wFSZVRQdAAAAA== To: Andy Gross , Bjorn Andersson , Rob Herring , Krzysztof Kozlowski , Robert Marko , Das Srinagesh Cc: Bhupesh Sharma , Vladimir Zapolskiy , Marijn Suijten , linux-arm-msm@vger.kernel.org, devicetree@vger.kernel.org, linux-kernel@vger.kernel.org, Konrad Dybcio X-Mailer: b4 0.12.2 X-Developer-Signature: v=1; a=ed25519-sha256; t=1680543384; l=2279; i=konrad.dybcio@linaro.org; s=20230215; h=from:subject:message-id; bh=Oe8NOlqI6eJ+DsG/9HBWcEqSh9kVrB8UltmKWG7DjW4=; b=KETWvJB5B1cGRgGv6EoAEJegYxKMFx6xHznjKtlgvFvTQuslWNwkf5G4at9TQaf3wz3XUpTX50Kd Sd06EoJeCPz0VCyTDBMPw0UirD1i+FF17G8OpP6lhQ0tSyfGy/D6 X-Developer-Key: i=konrad.dybcio@linaro.org; a=ed25519; pk=iclgkYvtl2w05SSXO5EjjSYlhFKsJ+5OSZBjOkQuEms= X-Spam-Status: No, score=-0.2 required=5.0 tests=DKIM_SIGNED,DKIM_VALID, DKIM_VALID_AU,DKIM_VALID_EF,RCVD_IN_DNSWL_NONE,SPF_HELO_NONE,SPF_PASS autolearn=unavailable autolearn_force=no version=3.4.6 X-Spam-Checker-Version: SpamAssassin 3.4.6 (2021-04-09) on lindbergh.monkeyblade.net Precedence: bulk List-ID: X-Mailing-List: linux-kernel@vger.kernel.org X-getmail-retrieved-from-mailbox: =?utf-8?q?INBOX?= X-GMAIL-THRID: =?utf-8?q?1762177562605410536?= X-GMAIL-MSGID: =?utf-8?q?1762177562605410536?= This series brings basic support for the Qualcomm Robotics RB1 board, including but not limited to: - TSENS-connected thermal management - USB2 - eMMC (uSD depends requires regulators to work, will be sent separately) - the necessary plumbing for *DSP + Wi-Fi (that also needs regulators) - buttons A compatible in the SCM C driver is not added on purpose, as: 1. it's not neccessary before we figure out disabling rpmcc, the dt part is in regardless (the clock it consumes is always-on today) 2. a point to get rid of SoC-specific compatibles in there was raised See also: https://www.thundercomm.com/product/qualcomm-robotics-rb1-platform/ https://www.qualcomm.com/products/internet-of-things/industrial/industrial-automation/qualcomm-robotics-rb1-platform Dependencies: - https://lore.kernel.org/linux-arm-msm/20230314-topic-2290_compats-v1-0-47e26c3c0365@linaro.org/ - https://lore.kernel.org/linux-arm-msm/20230315183231.3562580-1-konrad.dybcio@linaro.org/ - https://lore.kernel.org/linux-arm-msm/20230323173019.3706069-1-dianders@chromium.org/ Signed-off-by: Konrad Dybcio --- Konrad Dybcio (9): dt-bindings: firmware: document Qualcomm QCM2290 SCM dt-bindings: arm: qcom: Add QRB2210/QCM2290 and RB1 board arm64: dts: qcom: Add initial QCM2290, PM2250 & RB1 device trees arm64: dts: qcom: qcm2290: Add most QUPs arm64: dts: qcom: qcm2290: Add thermal zones arm64: dts: qcom: qcm2290: Add SMP2P arm64: dts: qcom: qcm2290: Add ADSP & modem arm64: dts: qcom: qcm2290: Add WCN3990 Wi-Fi node arm64: dts: qcom: qrb2210-rb1: Enable RESIN Volume Down Documentation/devicetree/bindings/arm/qcom.yaml | 8 + .../devicetree/bindings/firmware/qcom,scm.yaml | 3 + arch/arm64/boot/dts/qcom/Makefile | 1 + arch/arm64/boot/dts/qcom/pm2250.dtsi | 63 + arch/arm64/boot/dts/qcom/qcm2290.dtsi | 1561 ++++++++++++++++++++ arch/arm64/boot/dts/qcom/qrb2210-rb1.dts | 112 ++ 6 files changed, 1748 insertions(+) --- base-commit: 31bd35b66249699343d2416658f57e97314a433a change-id: 20230403-topic-rb1_qcm-78a8826b34b6 Best regards,