Message ID | 20230220123232.413029-1-marius.cristea@microchip.com |
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Headers |
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[2620:137:e000::1:20]) by mx.google.com with ESMTP id 18-20020a630612000000b004fc2f19bacasi12855962pgg.120.2023.02.20.04.43.23; Mon, 20 Feb 2023 04:43:35 -0800 (PST) Received-SPF: pass (google.com: domain of linux-kernel-owner@vger.kernel.org designates 2620:137:e000::1:20 as permitted sender) client-ip=2620:137:e000::1:20; Authentication-Results: mx.google.com; dkim=pass header.i=@microchip.com header.s=mchp header.b=CeVYdhKq; spf=pass (google.com: domain of linux-kernel-owner@vger.kernel.org designates 2620:137:e000::1:20 as permitted sender) smtp.mailfrom=linux-kernel-owner@vger.kernel.org; dmarc=pass (p=QUARANTINE sp=QUARANTINE dis=NONE) header.from=microchip.com Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S231731AbjBTMdB (ORCPT <rfc822;kautuk.consul.80@gmail.com> + 99 others); Mon, 20 Feb 2023 07:33:01 -0500 Received: from lindbergh.monkeyblade.net ([23.128.96.19]:53200 "EHLO lindbergh.monkeyblade.net" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S230257AbjBTMc7 (ORCPT <rfc822;linux-kernel@vger.kernel.org>); Mon, 20 Feb 2023 07:32:59 -0500 Received: from esa.microchip.iphmx.com (esa.microchip.iphmx.com [68.232.154.123]) by lindbergh.monkeyblade.net (Postfix) with ESMTPS id 56FA776A7; Mon, 20 Feb 2023 04:32:55 -0800 (PST) DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/simple; d=microchip.com; i=@microchip.com; q=dns/txt; s=mchp; t=1676896376; x=1708432376; h=from:to:cc:subject:date:message-id:mime-version: content-transfer-encoding; bh=vgSCEUc8iWaLUJXuISUE4WfvVHLMArLiY4LlOtGKzjE=; b=CeVYdhKqQX68jyRF9UBPb1yetaHoIyGVK5YUeJmex3hQKdNRmhHBYp6D oiru2zM86xdfNjwL9VZ41HyIG7jsNbRmoF8kMs8DNMBm+Tf7v+A6ZhirW X3Bx+ABbmp8qhYJNz0xlJ1m4P2vSThqzADqOAZcJjgR+os5uASi3v2Cd8 Hgwcy6jFh6TKgHCtsk7xwEbad0JcbKV6FUOdm1VtIrw/b2oyioZblZpi5 hSjDRMkTFsWph94G45J70Jsr/PCoe1AL2p4uzyMUxwVg15s4qVSfrxJOr fKmN+3Bf2GnX8AfjwPQZs0NIglClQR4bL+9gQl/BcZLCSruh443nN7Tbl g==; X-IronPort-AV: E=Sophos;i="5.97,312,1669100400"; d="scan'208";a="201422084" Received: from unknown (HELO email.microchip.com) ([170.129.1.10]) by esa2.microchip.iphmx.com with ESMTP/TLS/AES256-SHA256; 20 Feb 2023 05:32:55 -0700 Received: from chn-vm-ex04.mchp-main.com (10.10.85.152) by chn-vm-ex02.mchp-main.com (10.10.85.144) with Microsoft SMTP Server (version=TLS1_2, cipher=TLS_ECDHE_RSA_WITH_AES_128_GCM_SHA256) id 15.1.2507.16; Mon, 20 Feb 2023 05:32:51 -0700 Received: from marius-VM.mshome.net (10.10.115.15) by chn-vm-ex04.mchp-main.com (10.10.85.152) with Microsoft SMTP Server id 15.1.2507.16 via Frontend Transport; Mon, 20 Feb 2023 05:32:50 -0700 From: <marius.cristea@microchip.com> To: <jic23@kernel.org>, <lars@metafoo.de>, <robh+dt@kernel.org> CC: <linux-iio@vger.kernel.org>, <devicetree@vger.kernel.org>, <linux-kernel@vger.kernel.org>, <marius.cristea@microchip.com> Subject: [PATCH v1 0/2] adding support for Microchip PAC193X Power Monitor Date: Mon, 20 Feb 2023 14:32:30 +0200 Message-ID: <20230220123232.413029-1-marius.cristea@microchip.com> X-Mailer: git-send-email 2.34.1 MIME-Version: 1.0 Content-Transfer-Encoding: 8bit Content-Type: text/plain X-Spam-Status: No, score=-4.4 required=5.0 tests=BAYES_00,DKIMWL_WL_HIGH, DKIM_SIGNED,DKIM_VALID,DKIM_VALID_AU,DKIM_VALID_EF,RCVD_IN_DNSWL_MED, RCVD_IN_MSPIKE_H2,SPF_HELO_PASS,SPF_PASS autolearn=ham autolearn_force=no version=3.4.6 X-Spam-Checker-Version: SpamAssassin 3.4.6 (2021-04-09) on lindbergh.monkeyblade.net Precedence: bulk List-ID: <linux-kernel.vger.kernel.org> X-Mailing-List: linux-kernel@vger.kernel.org X-getmail-retrieved-from-mailbox: =?utf-8?q?INBOX?= X-GMAIL-THRID: =?utf-8?q?1758353964747167909?= X-GMAIL-MSGID: =?utf-8?q?1758353964747167909?= |
Series |
adding support for Microchip PAC193X Power Monitor
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Message
marius.cristea@microchip.com
Feb. 20, 2023, 12:32 p.m. UTC
From: Marius Cristea <marius.cristea@microchip.com>
Adding support for Microchip PAC193X series of Power Monitor with
Accumulator chip family.
Differences related to previous patch:
v1:
- first version comitted to review
Marius Cristea (2):
dt-bindings: iio: adc: adding dt-bindings for PAC193X
iio: adc: adding support for pac193x
.../bindings/iio/adc/microchip,pac193x.yaml | 122 +
MAINTAINERS | 7 +
drivers/iio/adc/Kconfig | 12 +
drivers/iio/adc/Makefile | 1 +
drivers/iio/adc/pac193x.c | 2072 +++++++++++++++++
5 files changed, 2214 insertions(+)
create mode 100644 Documentation/devicetree/bindings/iio/adc/microchip,pac193x.yaml
create mode 100644 drivers/iio/adc/pac193x.c
Comments
On Mon, 20 Feb 2023 14:32:30 +0200 <marius.cristea@microchip.com> wrote: > From: Marius Cristea <marius.cristea@microchip.com> > > Adding support for Microchip PAC193X series of Power Monitor with > Accumulator chip family. This device is at the messy boundary between IIO and HWMON. Perhaps call out the reasons you think IIO is more appropriate in this cover letter. + Often a good idea for these borderline parts to cc both mailing lists and maintainers. Often the conclusion is that it is fine to have these in IIO because we can bridge to hwmon anyway with the iio-hwmon driver. > > Differences related to previous patch: > > v1: > - first version comitted to review > > > Marius Cristea (2): > dt-bindings: iio: adc: adding dt-bindings for PAC193X > iio: adc: adding support for pac193x > > .../bindings/iio/adc/microchip,pac193x.yaml | 122 + > MAINTAINERS | 7 + > drivers/iio/adc/Kconfig | 12 + > drivers/iio/adc/Makefile | 1 + > drivers/iio/adc/pac193x.c | 2072 +++++++++++++++++ > 5 files changed, 2214 insertions(+) > create mode 100644 Documentation/devicetree/bindings/iio/adc/microchip,pac193x.yaml > create mode 100644 drivers/iio/adc/pac193x.c >
Hi Jonathan, Please, see my comments below... On Sat, 2023-02-25 at 17:11 +0000, Jonathan Cameron wrote: > EXTERNAL EMAIL: Do not click links or open attachments unless you > know the content is safe > > On Mon, 20 Feb 2023 14:32:30 +0200 > <marius.cristea@microchip.com> wrote: > > > From: Marius Cristea <marius.cristea@microchip.com> > > > > Adding support for Microchip PAC193X series of Power Monitor with > > Accumulator chip family. > > This device is at the messy boundary between IIO and HWMON. Perhaps > call out > the reasons you think IIO is more appropriate in this cover letter. > + Often a good idea for these borderline parts to cc both mailing > lists and > maintainers. > > Often the conclusion is that it is fine to have these in IIO because > we can > bridge to hwmon anyway with the iio-hwmon driver. > Indeed the driver (the device) is at the boundary between IIO and HWMON. I was thinking to start with a simple driver (this one that is more apropiate to be a HWMON) and add more functionality later (like data buffering that is quite important for example if someone wants to profile power consumtion of the procesor itself, or a pheriperic, or a battery) > > > > Differences related to previous patch: > > > > v1: > > - first version comitted to review > > > > > > Marius Cristea (2): > > dt-bindings: iio: adc: adding dt-bindings for PAC193X > > iio: adc: adding support for pac193x > > > > .../bindings/iio/adc/microchip,pac193x.yaml | 122 + > > MAINTAINERS | 7 + > > drivers/iio/adc/Kconfig | 12 + > > drivers/iio/adc/Makefile | 1 + > > drivers/iio/adc/pac193x.c | 2072 > > +++++++++++++++++ > > 5 files changed, 2214 insertions(+) > > create mode 100644 > > Documentation/devicetree/bindings/iio/adc/microchip,pac193x.yaml > > create mode 100644 drivers/iio/adc/pac193x.c > > > Thanks, Marius
On Mon, 6 Mar 2023 14:03:52 +0000 <Marius.Cristea@microchip.com> wrote: > Hi Jonathan, > > Please, see my comments below... > > > On Sat, 2023-02-25 at 17:11 +0000, Jonathan Cameron wrote: > > EXTERNAL EMAIL: Do not click links or open attachments unless you > > know the content is safe > > > > On Mon, 20 Feb 2023 14:32:30 +0200 > > <marius.cristea@microchip.com> wrote: > > > > > From: Marius Cristea <marius.cristea@microchip.com> > > > > > > Adding support for Microchip PAC193X series of Power Monitor with > > > Accumulator chip family. > > > > This device is at the messy boundary between IIO and HWMON. Perhaps > > call out > > the reasons you think IIO is more appropriate in this cover letter. > > + Often a good idea for these borderline parts to cc both mailing > > lists and > > maintainers. > > > > Often the conclusion is that it is fine to have these in IIO because > > we can > > bridge to hwmon anyway with the iio-hwmon driver. > > > > Indeed the driver (the device) is at the boundary between IIO and > HWMON. I was thinking to start with a simple driver (this one that is > more apropiate to be a HWMON) and add more functionality later (like > data buffering that is quite important for example if someone wants to > profile power consumtion of the procesor itself, or a pheriperic, or a > battery) > OK. List out some of the things you want to do later as the reasoning +CC hmwon maintainers just to be sure. They are usually fine with this sort of reasoning, but it is best to check anyway. Thanks, Jonathan > > > > > > > Differences related to previous patch: > > > > > > v1: > > > - first version comitted to review > > > > > > > > > Marius Cristea (2): > > > dt-bindings: iio: adc: adding dt-bindings for PAC193X > > > iio: adc: adding support for pac193x > > > > > > .../bindings/iio/adc/microchip,pac193x.yaml | 122 + > > > MAINTAINERS | 7 + > > > drivers/iio/adc/Kconfig | 12 + > > > drivers/iio/adc/Makefile | 1 + > > > drivers/iio/adc/pac193x.c | 2072 > > > +++++++++++++++++ > > > 5 files changed, 2214 insertions(+) > > > create mode 100644 > > > Documentation/devicetree/bindings/iio/adc/microchip,pac193x.yaml > > > create mode 100644 drivers/iio/adc/pac193x.c > > > > > > > Thanks, > Marius >