| Message ID | 20230303-topic-sm6375_features0_dts-v1-1-8c8d94fba6f0@linaro.org |
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From: Konrad Dybcio <konrad.dybcio@linaro.org>
Date: Fri, 03 Mar 2023 22:58:01 +0100
Subject: [PATCH 01/15] dt-bindings: thermal: qcom-tsens: Add compatible for
SM6375
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To: Amit Kucheria <amitk@kernel.org>,
Thara Gopinath <thara.gopinath@gmail.com>,
Andy Gross <agross@kernel.org>,
Bjorn Andersson <andersson@kernel.org>,
"Rafael J. Wysocki" <rafael@kernel.org>,
Daniel Lezcano <daniel.lezcano@linaro.org>,
Zhang Rui <rui.zhang@intel.com>,
Rob Herring <robh+dt@kernel.org>,
Krzysztof Kozlowski <krzysztof.kozlowski+dt@linaro.org>,
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Sibi Sankar <quic_sibis@quicinc.com>
Cc: linux-arm-msm@vger.kernel.org, linux-pm@vger.kernel.org,
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| Series |
SM6375 feature enablement (round one)
|
|
Commit Message
Konrad Dybcio
March 3, 2023, 9:58 p.m. UTC
The Qualcomm SM6375 platform has two instances of the tsens v2.8.0 block,
add a compatible for these instances.
Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org>
---
Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
1 file changed, 1 insertion(+)
Comments
On 03/03/2023 22:58, Konrad Dybcio wrote: > The Qualcomm SM6375 platform has two instances of the tsens v2.8.0 block, > add a compatible for these instances. > > Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Best regards, Krzysztof
diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml index 926e9c51c93c..d73b72dafcbc 100644 --- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml +++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml @@ -56,6 +56,7 @@ properties: - qcom,sdm845-tsens - qcom,sm6115-tsens - qcom,sm6350-tsens + - qcom,sm6375-tsens - qcom,sm8150-tsens - qcom,sm8250-tsens - qcom,sm8350-tsens