diff mbox series

dt-bindings: thermal: qcom-tsens: Add compatible for sm8550

Message ID 20221114-narmstrong-sm8550-upstream-tsens-v1-0-0e169822830f@linaro.org
State New
Headers
Series dt-bindings: thermal: qcom-tsens: Add compatible for sm8550 |

Commit Message

Neil Armstrong Nov. 16, 2022, 10:09 a.m. UTC 
  The Qualcomm SM8550 platform has three instances of the tsens block,
add a compatible for these instances.

Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
---
To: Andy Gross <agross@kernel.org>
To: Bjorn Andersson <andersson@kernel.org>
To: Konrad Dybcio <konrad.dybcio@somainline.org>
To: Amit Kucheria <amitk@kernel.org>
To: Thara Gopinath <thara.gopinath@gmail.com>
To: "Rafael J. Wysocki" <rafael@kernel.org>
To: Daniel Lezcano <daniel.lezcano@linaro.org>
To: Zhang Rui <rui.zhang@intel.com>
To: Rob Herring <robh+dt@kernel.org>
To: Krzysztof Kozlowski <krzysztof.kozlowski+dt@linaro.org>
Cc: linux-arm-msm@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: devicetree@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
---
 Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
 1 file changed, 1 insertion(+)


---
base-commit: 3c1f24109dfc4fb1a3730ed237e50183c6bb26b3
change-id: 20221114-narmstrong-sm8550-upstream-tsens-dfaec218c321

Best regards,

Comments

Krzysztof Kozlowski Nov. 16, 2022, 11:26 a.m. UTC | #1 
On 16/11/2022 11:09, Neil Armstrong wrote:
> The Qualcomm SM8550 platform has three instances of the tsens block,
> add a compatible for these instances.
> 
> Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
> ---
> To: Andy Gross <agross@kernel.org>
> To: Bjorn Andersson <andersson@kernel.org>
> To: Konrad Dybcio <konrad.dybcio@somainline.org>
> To: Amit Kucheria <amitk@kernel.org>
> To: Thara Gopinath <thara.gopinath@gmail.com>
> To: "Rafael J. Wysocki" <rafael@kernel.org>
> To: Daniel Lezcano <daniel.lezcano@linaro.org>
> To: Zhang Rui <rui.zhang@intel.com>
> To: Rob Herring <robh+dt@kernel.org>
> To: Krzysztof Kozlowski <krzysztof.kozlowski+dt@linaro.org>
> Cc: linux-arm-msm@vger.kernel.org
> Cc: linux-pm@vger.kernel.org
> Cc: devicetree@vger.kernel.org
> Cc: linux-kernel@vger.kernel.org
> ---
>  Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
>  1 file changed, 1 insertion(+)
> 
> diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> index f0bd4b979e28..09dbd96d380e 100644
> --- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> +++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> @@ -58,6 +58,7 @@ properties:
>                - qcom,sm8250-tsens
>                - qcom,sm8350-tsens
>                - qcom,sm8450-tsens
> +              - qcom,sm8550-tsens

alOf:if:then should be updated.

Best regards,
Krzysztof
Neil Armstrong Nov. 17, 2022, 8:06 a.m. UTC | #2 
Hi,

On 16/11/2022 12:26, Krzysztof Kozlowski wrote:
> On 16/11/2022 11:09, Neil Armstrong wrote:
>> The Qualcomm SM8550 platform has three instances of the tsens block,
>> add a compatible for these instances.
>>
>> Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
>> ---
>> To: Andy Gross <agross@kernel.org>
>> To: Bjorn Andersson <andersson@kernel.org>
>> To: Konrad Dybcio <konrad.dybcio@somainline.org>
>> To: Amit Kucheria <amitk@kernel.org>
>> To: Thara Gopinath <thara.gopinath@gmail.com>
>> To: "Rafael J. Wysocki" <rafael@kernel.org>
>> To: Daniel Lezcano <daniel.lezcano@linaro.org>
>> To: Zhang Rui <rui.zhang@intel.com>
>> To: Rob Herring <robh+dt@kernel.org>
>> To: Krzysztof Kozlowski <krzysztof.kozlowski+dt@linaro.org>
>> Cc: linux-arm-msm@vger.kernel.org
>> Cc: linux-pm@vger.kernel.org
>> Cc: devicetree@vger.kernel.org
>> Cc: linux-kernel@vger.kernel.org
>> ---
>>   Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
>>   1 file changed, 1 insertion(+)
>>
>> diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
>> index f0bd4b979e28..09dbd96d380e 100644
>> --- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
>> +++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
>> @@ -58,6 +58,7 @@ properties:
>>                 - qcom,sm8250-tsens
>>                 - qcom,sm8350-tsens
>>                 - qcom,sm8450-tsens
>> +              - qcom,sm8550-tsens
> 
> alOf:if:then should be updated.

I thought the -v2 fallback would be enough since 8450 isn't present either in the alOf:if:then either.

Anyway, will fix this.

Thanks,
Neil

> 
> Best regards,
> Krzysztof
>
Krzysztof Kozlowski Nov. 17, 2022, 12:58 p.m. UTC | #3 
On 17/11/2022 09:06, Neil Armstrong wrote:
> Hi,
> 
> On 16/11/2022 12:26, Krzysztof Kozlowski wrote:
>> On 16/11/2022 11:09, Neil Armstrong wrote:
>>> The Qualcomm SM8550 platform has three instances of the tsens block,
>>> add a compatible for these instances.
>>>
>>> Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
>>> ---
>>> To: Andy Gross <agross@kernel.org>
>>> To: Bjorn Andersson <andersson@kernel.org>
>>> To: Konrad Dybcio <konrad.dybcio@somainline.org>
>>> To: Amit Kucheria <amitk@kernel.org>
>>> To: Thara Gopinath <thara.gopinath@gmail.com>
>>> To: "Rafael J. Wysocki" <rafael@kernel.org>
>>> To: Daniel Lezcano <daniel.lezcano@linaro.org>
>>> To: Zhang Rui <rui.zhang@intel.com>
>>> To: Rob Herring <robh+dt@kernel.org>
>>> To: Krzysztof Kozlowski <krzysztof.kozlowski+dt@linaro.org>
>>> Cc: linux-arm-msm@vger.kernel.org
>>> Cc: linux-pm@vger.kernel.org
>>> Cc: devicetree@vger.kernel.org
>>> Cc: linux-kernel@vger.kernel.org
>>> ---
>>>   Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
>>>   1 file changed, 1 insertion(+)
>>>
>>> diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
>>> index f0bd4b979e28..09dbd96d380e 100644
>>> --- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
>>> +++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
>>> @@ -58,6 +58,7 @@ properties:
>>>                 - qcom,sm8250-tsens
>>>                 - qcom,sm8350-tsens
>>>                 - qcom,sm8450-tsens
>>> +              - qcom,sm8550-tsens
>>
>> alOf:if:then should be updated.
> 
> I thought the -v2 fallback would be enough since 8450 isn't present either in the alOf:if:then either.
> 
> Anyway, will fix this.


No, you are right. The v2 fallback is already in several allOf:if:then,
so this should be fine.


Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>

Best regards,
Krzysztof
Amit Kucheria Nov. 20, 2022, 6:52 a.m. UTC | #4 
On Wed, Nov 16, 2022 at 3:40 PM Neil Armstrong
<neil.armstrong@linaro.org> wrote:
>
> The Qualcomm SM8550 platform has three instances of the tsens block,
> add a compatible for these instances.
>
> Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>

Acked-by: Amit Kucheria <amitk@kernel.org>

> ---
> To: Andy Gross <agross@kernel.org>
> To: Bjorn Andersson <andersson@kernel.org>
> To: Konrad Dybcio <konrad.dybcio@somainline.org>
> To: Amit Kucheria <amitk@kernel.org>
> To: Thara Gopinath <thara.gopinath@gmail.com>
> To: "Rafael J. Wysocki" <rafael@kernel.org>
> To: Daniel Lezcano <daniel.lezcano@linaro.org>
> To: Zhang Rui <rui.zhang@intel.com>
> To: Rob Herring <robh+dt@kernel.org>
> To: Krzysztof Kozlowski <krzysztof.kozlowski+dt@linaro.org>
> Cc: linux-arm-msm@vger.kernel.org
> Cc: linux-pm@vger.kernel.org
> Cc: devicetree@vger.kernel.org
> Cc: linux-kernel@vger.kernel.org
> ---
>  Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
>  1 file changed, 1 insertion(+)
>
> diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> index f0bd4b979e28..09dbd96d380e 100644
> --- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> +++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> @@ -58,6 +58,7 @@ properties:
>                - qcom,sm8250-tsens
>                - qcom,sm8350-tsens
>                - qcom,sm8450-tsens
> +              - qcom,sm8550-tsens
>            - const: qcom,tsens-v2
>
>        - description: v2 of TSENS with combined interrupt
>
> ---
> base-commit: 3c1f24109dfc4fb1a3730ed237e50183c6bb26b3
> change-id: 20221114-narmstrong-sm8550-upstream-tsens-dfaec218c321
>
> Best regards,
> --
> Neil Armstrong <neil.armstrong@linaro.org>
Daniel Lezcano Dec. 6, 2022, 5:24 p.m. UTC | #5 
On 16/11/2022 11:09, Neil Armstrong wrote:
> The Qualcomm SM8550 platform has three instances of the tsens block,
> add a compatible for these instances.
> 
> Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
> ---

Applied, thanks
diff mbox series

Patch

diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
index f0bd4b979e28..09dbd96d380e 100644
--- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
+++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
@@ -58,6 +58,7 @@  properties:
               - qcom,sm8250-tsens
               - qcom,sm8350-tsens
               - qcom,sm8450-tsens
+              - qcom,sm8550-tsens
           - const: qcom,tsens-v2
 
       - description: v2 of TSENS with combined interrupt